New Intel Wi-Fi chipset will be unveiled next Tuesday

Originally scheduled for Q2 launch, Intel's new WiFi chipset code-named "Kedron" will be unveiled at an event next Tuesday, reported TG Daily.

Kedron is the wireless component and was intended to be introduced in tandem with the new mobile chipset code-named "Santa Rosa" in Q2 of this year. Kedron will be based on the draft-n wireless standard and promises to increase data transfer bandwidth as well as range of wireless devices.

Kedron has been shipping to vendors for a while, which suggests that Intel will actually be able to show Kedron in available products next week. Kedron will be officially named "WiFi Link 4965 AGN". There will be a Kedron part without draft-n capability ("WiFi Link 4965 AG") as well.

Santa Rosa will succeed Intel's Napa64 platform and bring the ICH8-based mobile 965 chipset, code-named Crestline, with support for FSB800 and the firm's Active Management Technology (AMT). The platform will get four new processors with Merom core, ranging from the Core 2 Duo T7100 (1.8 GHz) to the Core 2 Duo T7700 (2.4 GHz). Pricing for the processor will start at $209 for the T7100 with 2M of L2 cache and reach to $530 for the T7700 with 4 MB L2 cache.

The Santa Rosa announcement will also include Intel's flash cache technology "Robson", which will offer 512 MB or 1 GB of motherboard-integrated NAND flash memory.